Over the years, there have been remarkable advancements in the field of three-dimensional integrated circuits (3D ICs), particularly in the context of medical imaging devices. 3D ICs have revolutionized the way medical imaging is performed by offering improved performance, higher integration density, and enhanced functionality. One significant advancement is the integration of multiple sensors and processing units within a single chip, allowing for compact and portable medical imaging devices. This integration enables simultaneous acquisition of various types of imaging data, such as X-ray, ultrasound, and magnetic resonance imaging (MRI), in a streamlined manner. The 3D IC technology facilitates the seamless communication between different components, resulting in faster and more accurate diagnoses.

Moreover, the use of 3D ICs has significantly improved image quality in medical imaging devices. By stacking multiple layers of interconnected circuits, 3D IC enable the integration of advanced image processing algorithms directly into the imaging devices. This integration enhances image resolution, reduces noise, and improves overall image clarity, thereby aiding medical professionals in making more precise diagnoses. Furthermore, 3D IC have facilitated the development of miniaturized and wearable medical imaging devices. These compact devices, made possible by the high integration density of 3D IC, allow for real-time monitoring and imaging in various medical applications. They provide continuous and non-intrusive monitoring of vital signs, organ functions, and even early detection of diseases, improving patient care and overall health outcomes.